Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Tue Oct 15 15:10:17 EDT 2002 | bdoyle
You no doubt notice some pretty big changes on the site. We just launched some pretty major interface changes throughout the site. This project had been brewing for a while. We had been compiling support emails and looking at common threads. It s
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Sun Nov 24 09:54:24 EST 2002 | davef
On a HASL board that has poor wetting on the pad, consider looking further downstream in the process than your assembly shop. For instance, take a look at the bare boards. Look for solder mask bleed onto the pads. This will show-up on the outside
Electronics Forum | Tue Mar 04 07:23:15 EST 2003 | msivigny
Hello ricardof, To implement Cpk studies on SMT production equipment, you will require highly accurate glass plates, glass component slugs, accurately manufactured stencils and a measurement system to perform X, Y and Theta positional deviations from
Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman
we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Wed Apr 09 20:05:21 EDT 2003 | davef
Kevin: We know of no handy approach to developing recipes. * Certainly programs provided by profiler suppliers give you a good first pass, based on your oven and solder paste. * Second pass in developing your recipe comes through trail and error chan
Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef
Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas
Electronics Forum | Wed Apr 14 09:44:34 EDT 2004 | Vince Whipple
Frank, Your initial question about temperature profiling is a critical point to a good wave solder process. Especially if you have a No Clean flux. As recommended by many in the thread above, get the Process Data Sheet for your flux (this is not the
