Electronics Forum: profilers (Page 431 of 462)

BGA Voiding for RoHS

Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman

Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing

Temperature Profiling

Electronics Forum | Thu Dec 10 19:15:07 EST 2009 | swag

We like to keep one fully populated SMT golden per product (high volume) with t-couples soldered to it. We have best results using high temp. solder to attach t-couples (most permanent). 1) Remove all production solder from the part you are wanting

BGA Resistor Array Separating from Balls

Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie

Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X

Heat insulating box...

Electronics Forum | Mon Jun 07 15:33:08 EDT 2010 | bderks

Hi, I'm working at a very small electronics assembly firm and we need to get a better thermal profile of our reflow and solder wave ovens. Our firm is part of a larger firm that was set up to help handicapped people find work in the Netherlands. Yo

Plating Into Solution

Electronics Forum | Wed Aug 04 11:01:46 EDT 2010 | ooskii

I have a question concerning what plating will go into solution during the reflow process. I am soldering a small piece of ceramic (120x180 mils 7 mil thick) onto a flex circuit. I am seeing some fractures that I am sure are being caused by handlin

HOT AIR Bench top

Electronics Forum | Mon Jan 17 14:24:21 EST 2011 | vmorina

Hi Hege, Thank you very much for your input. So far I have four hot air from four different companies. ERSA: IR500 or IR550 http://www.ersa.com/index.php?modul=entry&id=346&entry_id=1473⊂_id=346&cont_add=467 Weller: WHA3000PS or VS http://www.te

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

Using isopropanol with DI water for rinsing after washing boards

Electronics Forum | Thu Nov 10 10:45:32 EST 2011 | aqueous

The use of IPA in automated defluxing systems is nearly extinct for the following reasons: 1. IPA is flammable. In a spray-in-air environment, the already low flashpoint is even lower. 2. IPA is not a great solvent. There are specific containme

0.031 pcb bowing -- solutions?

Electronics Forum | Mon Aug 27 11:51:47 EDT 2012 | cobham1

Its no my turn to give some advise. My first question would be can you put the boards into a carrier of some sort. There are many wonderful companies that make carriers that are ment for running down a smt line. This can be expensive unless you order


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