Electronics Forum | Wed Feb 02 11:49:18 EST 2000 | Greg Jones
HJ: We presented a paper on how to accomplish this at Nepcon 99: Reducing Oven Changeover Time by Finding Common Recipes for Mixed Production Lines It is available at: www.kicthermal.com/library/index.html Good Luck, Greg
Electronics Forum | Tue Dec 21 04:06:31 EST 1999 | Wolfgang Busko
Hi Edmund, if it is a 0603 chip there�s obviously something wrong either with your pads or the component itself. We do such things with vapourphase and do not have the possibility of adjusting the profile for bottomside and they still stick to the b
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Wed Dec 08 08:58:43 EST 1999 | taff
Hi ... I want to remove company assoc. Can anybody tell me how this works, after selecting "remove ...." I just get the profile with the same old company and should I continue .... nothing changes. Any clues thanks taff
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Wed Nov 17 07:20:10 EST 1999 | robert oertner
Sounds like you are running your conveyor too fast. Check your profile and see if your board is getting hot enough "max 125c on topside prior to hitting the wave. If so then slow it down, if not then increase your preheats and slow it down.
Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland
Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.
Electronics Forum | Thu Oct 07 22:05:23 EDT 1999 | Dreamsniper
Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard thanks and regards,
Electronics Forum | Wed Oct 06 20:46:10 EDT 1999 | Mike Cooper
We have same equipment and used the same adhesive. Switched to Loctite 3618 and problem went away. Check cure profile again. 150C at 90s best. Also, check dot size/patterns. Double dots for chips and 4-dot for SOTs works well for us. Regards.
Electronics Forum | Tue Sep 14 05:59:16 EDT 1999 | Edmund Loh
Can anyone out there pls enlighten me on how to solve chip tombstone defects. I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to solve t
