Electronics Forum | Fri Dec 15 11:45:38 EST 2000 | DaveJ
All, Thanks for your quick response. However, my primary concern is not the question of solderability advantages of nitrogen versus air. With all things (zone temps, track speeds, flow rates, etc.) being equal, what would be the profile differences o
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Thu Dec 07 15:51:02 EST 2000 | gsubbert
We have an old Blue M temperature chamber. We have no manuals for it and no information on how to make the cams to get the temperature profile that we need. If anyone has any information and would be willing to share it with me I would appreciate it.
Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT
We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu
Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles
Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp
Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX
Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu
Electronics Forum | Mon Aug 07 16:23:34 EDT 2000 | Ramon I Garcia C
Hi!!! Thanks frieds for your advising, I have a MPM UP2000, I'm going to chek the humidity control, too I'll chek the profiles again, this plant it's located close to the beach about 1/2 mile from. However if you know some table to calculate t
Electronics Forum | Tue Jul 11 10:28:02 EDT 2000 | John Thorup
Dave, George I think we're missing something here, or at least I am. While the plastic in question could possibly be dissipative or non generating, I'm wondering how thick such a stencil would be to clear even the lowest profile PTH component? Can w
