Electronics Forum | Sat Sep 07 06:57:33 EDT 2002 | mk
I agree but, are there really heavy metals in this water? Our process is as follows. Print Paste Reflow Board (no components, water soluble paste only) Wash Board Same reflow profile for almost every order so no solder balling issues etc. Carbon an
Electronics Forum | Fri Sep 06 11:16:08 EDT 2002 | dason_c
To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue. 1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4.
Electronics Forum | Fri Sep 13 13:58:06 EDT 2002 | soupatech
Hey Thanks! Yep, they are pricey but I think it would be a worth while expense to safegaurd $250,000 worth of leds! I will tell the powers that be and see if I can squeeze out some cash. If I scrap one loaded board could I use it for profiling 20 to
Electronics Forum | Mon Sep 09 21:02:30 EDT 2002 | davef
Bernard Interesting point. Please help us better understand: * Why do 'VIA hole, PTH hole sizes may need to be changed', aside from the obvious with hole-to-lead clearance? * What should the designer 're-evalaute the board before changing'? * What
Electronics Forum | Fri Sep 13 14:35:03 EDT 2002 | davef
Thanks Bernard. On your profile: Adding gold to your solder alloy will increase the liquious temperature. So slowing your reflow oven conveyor is a perfectly reasonable approach, especially for pads with low surface area. We don't even notice a di
Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton
I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Mon Sep 30 09:00:26 EDT 2002 | arcandspark
Russ, I have been reworking BGA's for over five years now and have never been able to remove voids in the solder balls without removing the BGA itself. Your thermal profile can also cause the voids along with a poor solder paste. I have experimented
Electronics Forum | Wed Oct 09 17:50:09 EDT 2002 | alj
Wrong..! It is a money loser for Teradyne and it will be cut in the future. Wow, auto thermal profiling.. Gee, that is a little late. When will the summit platform be redesigned. It's the same thing they sold 10 years ago with a few modificati
Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick
Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D
