Electronics Forum: profiling (Page 226 of 462)

Can I use lead free BGA parts in a lead based process?

Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor

There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup

AIM NC 298 Solder Paste

Electronics Forum | Fri Jun 18 13:20:42 EDT 2004 | jdumont

Thanks a lot. Actually, you are our local rep for AIM. Do you offer any services such as coming down to RI to set up a profile or anything of that nature? We currently use AIM 256 and the wetting isnt as good as I would like to see. Thanks JD

Solder balls

Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim

Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~

Grainy Solder Joints

Electronics Forum | Fri Jun 25 13:25:04 EDT 2004 | russ

Sounds like the wrong reflow profile was possibly used on this batch, Or you have a lead solderability problem. Usually you will pull a pad off of the board instead of the lead out of the solder joint. When a lead is torn from the joint it will ha

In same board both leaded and lead-free components used.

Electronics Forum | Tue Jul 13 06:49:53 EDT 2004 | imtiaz

In one board we are using 213 SMT components out of which 23 components are lead-free and the rest are leaded. The paste used is also leaded. Do we have to make any changes in the profile of our reflow oven ? Also will there be any negative effect on

25 mil QFP soldering issue

Electronics Forum | Mon Jul 19 08:55:54 EDT 2004 | dwanzek

Thanks, good input. The joints do seem to wet well, they pass solderability test we have done. The defect is apparent right after reflow, before wave solder. No we do not profiled with the oven loaded..... good idea. We run an ovenrider each shift an

Wavesolder PCBs encounter pinholes

Electronics Forum | Sun Jul 18 21:11:03 EDT 2004 | Thomas

Hi all, Need some advice on wavesolder pinholes issues. The PCBs are stored in a warehouse for 6 months and not vacuum packed. Before wavesodlering, boards are baked 2 hrs at 110 deg. But every piece of it has pinholes at random locations. PCB i

Wavesolder PCBs encounter pinholes

Electronics Forum | Sun Jul 18 21:15:05 EDT 2004 | Thomas

Hi all, Need some advice on wavesolder pinholes issues. The PCBs are stored in a warehouse for 6 months and not vacuum packed. Before wavesodlering, boards are baked 2 hrs at 110 deg. But every piece of it has pinholes at random locations. PCB i

Un-Reflowed Paste

Electronics Forum | Mon Jul 26 15:05:36 EDT 2004 | Chris C

We are seeing un-Reflowed paste along the IC leads. There is only a very small amount imbedded in the flux, typically there is about 10 beads per lead. But on most leads. We are using no-clean Kester 256 paste (Easy Profile)We have not encountered th

BGA ziff socket rework

Electronics Forum | Fri Jul 30 03:33:07 EDT 2004 | tuner73

Is anyone out there reworking the AMP BGA ziff sockets? AMP's recommendation is that it cannot be reworked. I have successfully reworked the 604 ball version of this socket, but I am having problems with the 603 ball version. I am using an Air-Vac


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