Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen
We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i
Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech
Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten
Electronics Forum | Wed Jan 15 11:42:57 EST 2003 | burb1999
we have recently been trying silver composition on our pads with our PCB boards. I am wondering what if any characteristics are different from tin etc... I have found with profiling the board it to be about the same temps. but getting granular looki
Electronics Forum | Mon Jan 20 19:07:41 EST 2003 | slthomas
Sorry, what I meant was that they don't provide a duration for that liquidus + 20�C value that I've seen bantered about here and on TechNet. They only provide the same stock time above liquidus of 30-90 that they've always used. I'd like to see refe
Electronics Forum | Tue Jan 21 11:11:07 EST 2003 | slthomas
OK, so the issue is with the variability of the alloys on the soldering surfaces and the subsequent variability of reflow temps. Sounds reasonable (actually obvious, now that I think about it), especially on the component side. We only use HASL fin
Electronics Forum | Thu Mar 06 18:21:29 EST 2003 | ppwlee
Mike, What is the most common method for monitoring and calculating machine capability for: - Reflow oven, I currently run a carrier monthly to monitor its temperature profile and would like to simplify the process. - P&P machines: We don't have a
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Fri Apr 11 16:07:08 EDT 2003 | daanterstegge
I'd say your profile is about right, assuming these are values that you measured in the balls of this BGA and not elsewhere on the board. If you want a more shiny joint than use a nitrogen oven or experiment with various solder pastes, but why the he
