Electronics Forum | Wed Feb 09 10:20:26 EST 2000 | Sal
Currently we have started seeing an issue around a scuzzy connector.The problem being that during insertion of this connnector a couple of pins refused to be inserted and as a result fold over, this folding of the pin is causing the pin itself to fra
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Tue Nov 07 02:50:41 EST 2000 | CharTrain
A solder wetting balance will indicate a time of less than one second for wetting to occur to a solderable surface. The additional time is required to get the metalized surfaces up to soldering temperature. A single sided board has very little mass a
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F
It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10
Electronics Forum | Tue Oct 03 16:56:32 EDT 2000 | JAX
Not sure if I agree with your justification but I might need to read it a few more times to figure it out. I agree that aquiring a dispensing machine is is a good purchase. Maybe you should let him in on the material savings. How many adhesive stenci
Electronics Forum | Tue Sep 26 09:42:38 EDT 2000 | Chris May
I have to agree with Wolfgang & Jacko. Two months ago, I decide to run a lead free paste trial. The paste was supplied by company "X", and they stayed on site to witness evaluation. I trialled the paste using EXACTLY THE SAME equipment, stencil and
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Mon Aug 21 12:08:36 EDT 2000 | Dason C
Hi! I had experience with my customer complain about the delamination on BGA. The first question, I will ask my customer how they removed the parts and de-cap (my customer is using de-cap instead of SEM, I prefer SEM). Most of the customer which I
