Electronics Forum | Mon Jul 05 18:45:01 EDT 1999 | JohnW
| Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | John, No clean is as good as your process, and the paste you are using. Everything I do is no clean and I h
Electronics Forum | Thu Jun 03 12:22:14 EDT 1999 | Scott
Is there room for equipment related comments? Although vendor "bashing" may/may not be proper on the forum, I'd just LOVE to share experiences with equipment - why I won't buy a UPS from one oven vendor, or it wasn't said profiling was an optioin du
Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Mon Jun 07 11:25:41 EDT 1999 | Brian Wycoff
| | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave solder
Electronics Forum | Mon Jun 07 16:52:51 EDT 1999 | Dave F
| | | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave sold
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Wed Oct 03 13:48:42 EDT 2001 | rocco
hello every body !! We are assembling a new product with some kind of components like (soic)but this component has a metalic surface under the package that works like pin,is a ground terminal,and in the PCB you can see a pad, among the other pads,so
Electronics Forum | Fri Apr 30 10:34:16 EDT 1999 | Ryan Jennens
Mornin! We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be advantag
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
