Electronics Forum: profiling (Page 366 of 462)

Epoxied Parts Falling Off

Electronics Forum | Thu Feb 20 10:56:49 EST 2003 | larryk

Interesting topic, I got a side bar question. The epoxy companies suggest a lower consistant temp (something like 1 minute at 160 degrees) for curing. But we epoxy and paste our boards that get waved. (I know, why are ya pasting a board that goes t

AOI, Pre or Post Reflow?

Electronics Forum | Sat Mar 08 02:43:16 EST 2003 | Frank

We are trying to implement AOI into the mix. One PE wants it Pre-Reflow, to catch and fix the PnP screw ups and the other PE wants it Post-Reflow, because the oven will fix quite a bit of placement offsets and mainly to catch any problems that the R

Tantalum caps causing misaligned parts

Electronics Forum | Fri Mar 21 14:44:02 EST 2003 | Stephen

I once worked for a new branch of a company. We had a board where one of two tants would shift in the oven. When I phoned up HQ because they had ran the board before as soon as I said the product name their guy said "C148 shifts in the oven" He knew

8 way 1606 resister arrays

Electronics Forum | Fri Mar 21 20:24:13 EST 2003 | msimkin

Has anyone had success in soldering these devices, in particular devices from a company callede Pycomp. They are 8 way 0402 sized terminations. I have experemented with the printing process, placement verification & reflow profile. Unfortuanlty, I am

BGA attach eval.

Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf

I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro

BGA Rework

Electronics Forum | Thu Apr 10 03:29:16 EDT 2003 | emeto

Hi, that post sounds very bad.But I thing you shoul make an order for that problem.First the problem as I can see is not single.If I am right you should do exams step by step: 1.Design of the board-examine very carefuly(ask the manifacturer for help)

Cracked ceramic chip capacitors.

Electronics Forum | Fri Apr 11 11:26:09 EDT 2003 | Brian W.

Cracked capacitors usually are not found at ICT. Unless the cap is completely cracked, the capacitance may not change much, and the usual failure mode is a leakage current. This is usually only seen in ESS type testing, when temperature and humidit

Voids in solder fillet

Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire

Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode

Void in CSP

Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef

Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;

Reflow process

Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc

I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t


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