Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F
Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY
Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th
Electronics Forum | Sat Sep 23 09:50:40 EDT 2000 | Dave F
KC, Try: Mil-P-50884C - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=27738 Mil-PRF-31032/3 - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=201451
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Thu Jul 13 04:56:29 EDT 2000 | dutkell
John, I totally agree with you on all your above comments. You obviously have a real grasp of your subject, and are very knowledgeable. My colleague and I would like to take this opportunity to request information on personnel ' training' aspects re
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F
Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
