Electronics Forum | Thu Sep 16 07:07:34 EDT 2004 | C Lampron
Hello Chris, "It sticks up about 3/8" or so above the surface of the board." Is this over the ridgid portion of the PCB or in between? Is it possible to create a support fixture for printing that has relief that will allow the flex to bow downward i
Electronics Forum | Thu Sep 16 15:28:06 EDT 2004 | rohman23
Actually, it's not even close to 3/8". It's more like 0.075"...not sure what I was smoking last night (I tried to guess on dimensions from my house, and now I have one in front of me). Anyway, to answer your question, the bulge is in between side A
Electronics Forum | Fri Sep 17 09:31:33 EDT 2004 | C Lampron
Hi Chris, It sounds like you may have to go with your idea of a relief cut into the stencil. Are there any components that need to be printed in close proximity? Is this a high volume?I used to work at a flex house and we had a similar situation. We
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Mon Feb 21 10:05:33 EST 2005 | Dougs
Our machines can place components down to 16mil, I've never seen any finer pitch components in use, what pitch are they going down to now? 12mil??? What pitches have you been using? We are a contract manufacturer so customers sometimes supply free
Electronics Forum | Tue May 31 20:20:54 EDT 2005 | Rob
Hi, I was informed that our supplier of PWB's will start using RoHS compliant Materials but will still support HASL. And these are the materials that they will use: Standard FR-406-408 High Temp - polyimide, cyanate ester High Temp - Roger's, Teflo
Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg
Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would
Electronics Forum | Wed Sep 21 16:23:36 EDT 2005 | 14367
I was going to ask the same question. As was mentioned, it depends on the classification of product. If it's IPC Class 3, with a requirement for high reliability, I'd want the OEM manufacturer to have a defined statement on this issue for more that
