Electronics Forum: pwb and racks (Page 1 of 3)

PWB packaging for shipment and storage

Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz

Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor

Solder Paste and Stencils

Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG

Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more

Touch-up and Inspection Process

Electronics Forum | Tue Mar 01 10:31:26 EST 2005 | Greg

QC --> Touch-up --> QC --> Assembly After SMT all PWB goes to QC, QC Inspects and marks all that needs rework then PWB's goes to Touch-up to fix what QC marked for rework. After that All reworked boards goes to QC for another verification and stampi

Stencil cleanliness and inspection

Electronics Forum | Tue Jun 05 20:45:54 EDT 2001 | davef

So, yer lookin' to detect a ~25um glob on the wall of the aperture on yer stencil, eh? Why not wash your stencils before you put them away? That's what we do. Give 'em a quick looksee, then rack 'em, if they're clean. Give 'em anudda looksee befo

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG

Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

essemtec csm7100/csm7000 and pantera assistance

Electronics Forum | Sun Oct 31 03:46:34 EDT 2021 | earesearch

Hello, I currently have several csm7100, csm7000plus and pantera xv from essemtec. I wanted to see if anyone here was interested in training per hour or job. I have another friend who also has a csm7000 and needs some assistance in a few areas to g

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