Electronics Forum: qfn and residue (Page 1 of 14)

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 10:46:27 EDT 2005 | lyrtech

Hi, I curently have an interesting challenge. But I don't have all the knowledge to solve it. One of our boards is used in RF applications. We noticed that the No-Clean flux residue makes interferences in the RF signal. Removing the flux residue so

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:24:02 EDT 2005 | patrickbruneel

Yes a No-Residue solder paste exist. email me for more info Pat

No-Clean flux residue and RF application

Electronics Forum | Wed Aug 31 04:04:32 EDT 2005 | Slaine

im running some tests at the moment for hand soldering using a no residue water based flux from MBO, called WBF-01. leaves a good clean finish.

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 15:05:23 EDT 2005 | Shean Dalton

Dear Ing, Have you analyzed why some RF device aren't operational after washing? An assumption is that failures are related to the ultrasonic energy applied. Other possibilities are for poor rinsing, poor drying, inadequate washing on those failed

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:08:09 EDT 2005 | slthomas

The answer for us at my previous employer was water soluble flux. Wash the board, no residue. If you're not set up to wash (needing a washer, DI water source, waste treatment, ventilation, etc.) it can be expensive and space consuming. Do some resea

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson

This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

QFN's and LGA's

Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva

Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht

PCB Thickness and BLR

Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw

That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

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