Electronics Forum: qfn and solder and void (Page 1 of 4)

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

OSP finish and Omnix 5002 solder paste(SnPb)

Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz

I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman

Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? I

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