Electronics Forum: qfn and toe (Page 1 of 6)

QFN's and LGA's

Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva

Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht

PCB Thickness and BLR

Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw

That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.

QFN's and LGA's

Electronics Forum | Wed May 20 17:00:56 EDT 2009 | dyoungquist

We just placed a 56 pin QFN, 1 per board, on 10 boards and had zero defects. A good paste job, proper placement and a correct oven profile are the keys. If these are set up correctly, on larger runs your defects won't be zero but they should be le

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

QFN's and LGA's

Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge

Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

QFN's and LGA's

Electronics Forum | Wed Jun 03 16:10:54 EDT 2009 | mattkehoe

Here is a little different spin on re-working/hand placing LGA's.. http://www.sipad.com/download/LGA%20Rework%20Document.pdf

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

No Clean and Underfill

Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron

Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems

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