Electronics Forum | Fri Jul 30 14:16:11 EDT 2004 | C.W
For VIA In PAD design, what's the difference between a thru vias and a blind via? thanks' chester
Electronics Forum | Fri Jul 30 14:21:36 EDT 2004 | C.W
what's the difference between a thru vias and a blind via?
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Electronics Forum | Mon Aug 02 11:49:02 EDT 2004 | jbabson1
Blind vias are just that. They do not show on the surface sides of the pwb.
Electronics Forum | Sat Jul 31 17:27:50 EDT 2004 | C.W
thanks! So, why via in pad design is implemented? what's the advantages of it?
Electronics Forum | Mon Aug 02 13:46:10 EDT 2004 | Bob R.
Via in pad lets your layout guy run traces on inner layers so there's more more area available on the outer layers for placing parts, test point, etc. There are also electrical advantages due to shortening paths, but I'm just a simple mechanical eng
Electronics Forum | Fri Jul 30 16:12:12 EDT 2004 | davef
Search for "SMT Terms and Definitions" in the "Library & Bookstore" tab in the light blue area on the left of your screen.
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva
Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer