Electronics Forum: qfn vias (Page 1 of 5)


Electronics Forum | Thu Oct 01 06:18:10 EDT 2009 | rajeshwara


QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 09:29:36 EST 2017 | kojotssss

Hello. We have a problem with QFN type. Component is elevated. Stencils are reduced. Vias is without holes. What are the solutions to fix the fault. Look at the photo. Attachment: https://drive.google.com/open?id=1OIgaXUz2yoKP3fWZg2rUsrmZMBWidk6_

Reflow issue with QFN

Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10

It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often

QFN PCB Pad no Drain Hole

Electronics Forum | Fri May 17 10:08:47 EDT 2013 | shrikant_borkar

HI, We are facing problem of Dry solder due to QFN Grounding Solder not Drain out in Via hole. also No drain hole on PCBs now we have 15k stock. which is leading to massive Rework. We have Tried by minimizing Ground Square apertures. but no Improvem

QFN void issue

Electronics Forum | Fri Jun 20 03:47:24 EDT 2008 | philip

Hi all, any good recommendation for PbF paste application to reduce voids underneath the QFN thermal pad (stencil thickenss? opening? via hole? reflow profile etc)? We have tried few stencil opening design but no significant improvement as seen. Ther

Circuit Card Assembly Molding

Electronics Forum | Thu Mar 24 11:04:41 EDT 2011 | smt_guy

Hi, I have a 2.75" x 1" x 0.027"thick CCA with SOIC16W and QFN56 as well as some 0201's, 0402's and QFN16 Components that are to be enclosed via molding process. Is there any Insert Moling, Over Molding Circuit Card Assembly Guidelines out there fr

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 15:22:46 EST 2017 | kojotssss

Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder mask on the backside and filled with solder. Solutions at this moment ? Thanks for all :)

QFN voiding levels

Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman

Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages

QFN soldering

Electronics Forum | Wed Nov 14 01:00:20 EST 2007 | reypal

recently, we also have problem with QFN around 3% defect related to soldering. from the cross section it turns out to be solder crack. it could be the paste volume on the center pad is too much causing QFN to float that eventually will cause crack on

QFN standoff, industry standard

Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat

We have seen that vias included in the PCB under the thermal pad will give less voiding.

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