Electronics Forum | Thu Oct 01 06:18:10 EDT 2009 | rajeshwara
METHOD OF VIA DESIGN AT EXPOSED PAD FOR QFN/QFP.
Electronics Forum | Fri Dec 01 09:29:36 EST 2017 | kojotssss
Hello. We have a problem with QFN type. Component is elevated. Stencils are reduced. Vias is without holes. What are the solutions to fix the fault. Look at the photo. Attachment: https://drive.google.com/open?id=1OIgaXUz2yoKP3fWZg2rUsrmZMBWidk6_
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Fri May 17 10:08:47 EDT 2013 | shrikant_borkar
HI, We are facing problem of Dry solder due to QFN Grounding Solder not Drain out in Via hole. also No drain hole on PCBs now we have 15k stock. which is leading to massive Rework. We have Tried by minimizing Ground Square apertures. but no Improvem
Electronics Forum | Fri Jun 20 03:47:24 EDT 2008 | philip
Hi all, any good recommendation for PbF paste application to reduce voids underneath the QFN thermal pad (stencil thickenss? opening? via hole? reflow profile etc)? We have tried few stencil opening design but no significant improvement as seen. Ther
Electronics Forum | Thu Mar 24 11:04:41 EDT 2011 | smt_guy
Hi, I have a 2.75" x 1" x 0.027"thick CCA with SOIC16W and QFN56 as well as some 0201's, 0402's and QFN16 Components that are to be enclosed via molding process. Is there any Insert Moling, Over Molding Circuit Card Assembly Guidelines out there fr
Electronics Forum | Fri Dec 01 15:22:46 EST 2017 | kojotssss
Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder mask on the backside and filled with solder. Solutions at this moment ? Thanks for all :)
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat
We have seen that vias included in the PCB under the thermal pad will give less voiding.
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
