Electronics Forum | Tue Sep 15 13:30:40 EDT 1998 | Dave F
| We are looking at a third P&P machine for our factory. I have received brochures on a SMASUNG CP30V machine. It looks great and has all the plus points for a contract manufacturing company such as ourselves. The basic specs are: | 14400 cph - 3 he
Electronics Forum | Wed Feb 25 23:19:41 EST 1998 | Steve Gregory
Eric, You've got a Fuji FHP? WOW! It still runs even! That was the first fine pitch machine I ever worked with, along with the FEP's and CP-2's. Unless Fuji has changed the machine software, I don't know what he may be talking about. They
Electronics Forum | Mon Dec 08 14:40:08 EST 1997 | Rin Or
| First Responses Lost: Please Repost | | Looking for info on process flow for 2 sided SMT with PTH | | on the top side. | | Both sides have large SMT ICs. I don't know what the best approach is; | | Epoxy, Paste in Hole, High temp paste. | | Any in
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ
We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you
Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40
Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The
Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan
Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC
Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
