Electronics Forum | Thu Nov 03 16:47:52 EDT 2011 | hegemon
You need to define what it is you are inspecting for, and more importantly, what benefits you are trying to achieve with your acquisition of the technology? Inspecting post placement, post reflow, or both? Solder Joints? Through Holes? Part numbers
Electronics Forum | Tue Nov 20 19:56:12 EST 2012 | hegemon
In order to be able to do full prototype assembly, you will need to be able to mount and reflow a large number of different devices of differing technology. One part might be a simple QFP, another might be a .4mm pitch uBGA. If you are prototyping a
Electronics Forum | Tue Mar 12 10:16:05 EDT 2013 | bocci572
Yes the components are flat and no larger than 50mm in size. Most are full rings or just an arc of a ring. I understand fully the best way to have the capabilities proven would be to have the vendor demonstrate. I am kind of looking at what people
Electronics Forum | Thu Apr 03 17:39:37 EDT 2014 | siddharth
You are correct. Both the machines are "semi-automatic". The program can focus on the part you want to inspect and perform basic inspections like void analysis (BGA, QFP) etc. But you have to manually navigate and look for defects like TH solder fill
Electronics Forum | Sun Jun 29 02:50:37 EDT 2014 | alexeis
Hi, The issue is very complex and difficult to arbitrarily divide the types of components. From research we perform today together with our customers to design a work-at-SMT accurate as much as possible, I can summarize that vast time differences de
Electronics Forum | Fri Jul 18 03:21:59 EDT 2014 | skipbruce
Hello June The following infomationI find from net for you reference. OSP (Organic Solderability Preservative) 1)Preserves copper surface from oxidation until asse mbly. 2) Very thin coating (100-4000 Angstroms). 3)Applied in a vertical (dip tank
Electronics Forum | Thu Aug 07 09:24:42 EDT 2014 | tombstonesmt
Good morning everyone! I'm searching through tech sheets and equipment manuals to determine the recommended paste thickness on the stencil during operation. We use a MPM momentum screen printer using SAC305 paste. Board isn't too complex; one QFP, co
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Fri May 01 21:34:26 EDT 2015 | sarason
I have added the TWS Quadra format to my program PCBSynergy Which can be downloaded here. http://members.iinet.net.au/~sarason/ I have only just released this update in the last 2 weeks.But I wrote it about 8 months ago so all the details are fuzz
Electronics Forum | Wed May 06 20:52:26 EDT 2015 | arbpkevin
I have been using my topaz X for about 4 years now and I feel that I am fairly knowledgeable about it, at least the functions of it that I use... I am trying to use the LCS to place some qfp chips on a new product and I have set the whole thing up t
