Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro
There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ
Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24
Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem
Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro
Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Wed May 13 13:22:39 EDT 2015 | cohlmann
Hello Everyone. We are setting up our first SMT line and are looking for recommendations on printers and reflow ovens. Currently most of our manufacturing is outsourced and we want the ability to manufacture all of our products in-house. One impor
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
