Electronics Forum | Wed Feb 07 07:36:11 EST 2007 | jax
mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20
Electronics Forum | Wed Apr 18 08:44:15 EDT 2007 | pjc
Every failure analysis study I've seen, (and quite a few by now) showes Pb Free failing in about half the time or cycles as Sn/Pb. HALT and HASS testing shows reality- run way from a Pb Free product other than a camcorder, etc...
Electronics Forum | Thu Apr 19 20:27:25 EDT 2007 | Wayne
Agreed. Like I mentioned it before, all the leadfree solders are currently for consumer products. Military, aerospace & some automotive industry haven't implemented leadfree yet. They are still study which to go! Maybe by that time (finalized which t
Electronics Forum | Thu Jun 14 06:41:28 EDT 2007 | davef
No, raising the solder pot temperature to 800*F will not affect affect your solder alloy. We expect that you had a fairly high level of intermetallic compound generation, but most of that would be included in the fairly high dross generation that ha
Electronics Forum | Fri Jun 22 09:56:24 EDT 2007 | crashoveride
uhm.... we're not doing this solderability test that often... it's more likely of a run-to-failure, lolz.. anyway, i think this should be quality department's problem since they do the production monitoring (In- line QC), Material sampling and gatin
Electronics Forum | Mon Sep 29 14:47:07 EDT 2008 | ikonify
Have seen similar problem before with regards the MSD being the cause. But also seen similar defects being found at functional test as the in-circuit test was injecting to much current during test. The devices were walking wounded afterwards. The in
Electronics Forum | Thu Aug 13 03:41:30 EDT 2009 | robhs
At risk of raising a topic that has already been discussed at length, if that is the case then please point me in the right direction. We have a Lead-Free assembly that has BGA devices on both sides of the board. Any recommendations as to how we mig
Electronics Forum | Mon Sep 20 14:23:50 EDT 2010 | dekhead
No, there is not a way to initialise into the diagnostics menu with the head raised / covers open. Literally lowering the head manually (prop head, disconnect actuator, etc) is naturally possible, but not receommended... and based upon your symptom
Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1
First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.
Electronics Forum | Mon Jul 01 13:25:31 EDT 2013 | tpost
I think it is wetted also but I cannot verifiy without actually seeing the toe, heel or side fillets. In this case, the lead was overhanging the pad and as with this type of lead it is not acceptable so they were reworked. Many times rework personel
