Electronics Forum: ramping (Page 1 of 61)

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Mon Nov 26 20:41:24 EST 2001 | davef

Which ramp is this? * Ramp to preheat? * Preheat? * Ramp to spike?

profile ramp starts in??

Electronics Forum | Mon Feb 20 19:35:28 EST 2006 | darby

From Indium Guru, (Hi Rich). "Ramp can be taken anywhere.... but mainly you want to look at the ramp when the flux is doing it's job. For the Indium paste, I would set a ramp rate of 100 to 200 (or 120 to 210).. somewhwere in that range should provi

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Wed Nov 03 14:11:18 EST 2004 | russ

Sam, are you asking or telling us these things? russ

profile ramp starts in??

Electronics Forum | Mon Feb 20 15:45:03 EST 2006 | campos

thats the point: paste SMQ230 indium suggest a ramp between 0.5 a 1.0 degree,,but what ramp?? from 50 to 217 ,, 100 to 217,,,any idea?? i m using a ramp with .8 degree considering 50 a 217,,is teha correct????....thanks.

QFP144 soldering problem

Electronics Forum | Fri Sep 14 09:34:17 EDT 2007 | russ

you using a ramp soak spike or ramp to spike profile? you may be burning out your flux in preheat if you ramp to fast or for too long, most pastes have 2 activation points for their flux one at low temp and one at higher temp. Try a ramp to peak pr

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 18:01:20 EST 2004 | davef

Rethinking to Ramp / Soak: Yano, staying with ramp might not be all that bad after all, just decrease the ramp / slow-down the conveyor.

BGA's ramp up rate in a convection oven

Electronics Forum | Tue Dec 28 09:31:45 EST 2004 | davef

The ramp rate of the temperature of your solder is more important than the ramp rate of the temperature of the plastic case of your BGA.

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP

James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

Reflow Profile Type

Electronics Forum | Tue Jun 03 15:18:33 EDT 2008 | jdengler

As chunks says use the paste manufacturers recommendation. Our paste manufacturer has recommendations on both �straight ramp� and �soak� for our paste. We prefer the �straight ramp� on most boards due to the increased production it enables. There a

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