Electronics Forum | Sat May 01 10:04:35 EDT 1999 | Bob Willis
| I would like to know if there is any good training for Hand Soldering, Component Identification, Wave Soldering, and so on. | | I have seen two diffenent tapes and they were short and poorly done, I would like to buy some if I knew it had some goo
Electronics Forum | Thu Apr 22 16:07:36 EDT 1999 | Rick
| | Do solders exist that are both lead-free and low-temperature (e.g. 100-170 Celsius range)? If so, who supplies these materials? Any websites or contact information would be most helpful. | | | | Also, I am not an expert on soldering, so any
Electronics Forum | Tue Apr 13 09:50:18 EDT 1999 | Dave F
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Cho
Electronics Forum | Thu Mar 11 23:56:47 EST 1999 | Andy Norton
| | I'm in the process of selecting a medium speed pick & place machine. I need to place a wide range of components from 0805 | | chips to a 144 pin MQFP (32mm square 25mil lead spacing). | | | | Anyway, I'm looking at the Quad QSA-30, the Philips
Electronics Forum | Tue Mar 16 18:03:05 EST 1999 | Russell Bartley
| I'm in the process of selecting a medium speed pick & place machine. I need to place a wide range of components from 0805 | chips to a 144 pin MQFP (32mm square 25mil lead spacing). | | Anyway, I'm looking at the Quad QSA-30, the Philips Orion |
Electronics Forum | Wed Mar 17 11:31:45 EST 1999 | Quadmaster
| | I'm in the process of selecting a medium speed pick & place machine. I need to place a wide range of components from 0805 | | chips to a 144 pin MQFP (32mm square 25mil lead spacing). | | | | Anyway, I'm looking at the Quad QSA-30, the Philips
Electronics Forum | Thu Dec 17 10:25:19 EST 1998 | Earl Moon
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Mon Dec 21 17:50:55 EST 1998 | anamonus
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Wed Oct 28 18:02:06 EST 1998 | Jeff Kline
| Does anyone have info on any of these systems (good or bad). We are looking at these 3 types for a new SMT pnp machine. We are low volume high mix. | | Thanks, Dave | I may be able to supply you with some valuable info on all three manufacture
Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
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