Electronics Forum | Thu Oct 04 20:50:45 EDT 2007 | itaig1
We recently purchased an IBL VPP-M600 vapour phase reflow oven. We currently only have partial documentation and need to know the requirements for the water cooling. ie flow rate, cooling power etc. We also need the spare parts listing and service ma
Electronics Forum | Mon Oct 15 04:01:52 EDT 2007 | itaig1
Thank you for your reply. We are mainly interested in what are the cooling requirements in kW of cooling power and the required flow rate. We purchased an electronic version of the operators manual from IBL however the manual makes reference to secti
Electronics Forum | Wed Oct 10 09:42:02 EDT 2007 | fredc
Hello Sr.Tech, There have been two types of nozzles made by Fuji for 0201's one was a 1mm tapered to .4mm and the other has a straight .4mm tube. Has one superceded the other and if you have used both types, did one work better than the other? Asking
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Thu Dec 13 19:19:44 EST 2007 | bga_kid
First of all you need to profile your board.....no one is going to be able to tell you what setting to run without know the product and components. You are also going to want to check the paste spec. against you temp. ramp/rise rates. Just guessing y
Electronics Forum | Mon Dec 17 09:00:16 EST 2007 | rgduval
The oven's maximum rating isn't really a good indicator as to whether or not it's good for LF. The real question is can the oven get your board up to the liquidous temperature of the lead free solder that you're using. So, an oven that has a max te
Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas
But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's
Electronics Forum | Wed Jan 23 09:36:51 EST 2008 | operator
"A minimal ventilation rate of 0.05 cfm per square foot," This would be per Cubic Feet correct? In our factory that would be about 40,000CFM.(3 ACH) If we wanted 10 ACH we would need apprx. 120,000CFM. We probably have about 2,000-4,000CFM currently.
Electronics Forum | Wed Jan 30 12:38:12 EST 2008 | slthomas
"They ended up hiring a guy for the going rate around town so they shot themselves in the foot." Well, except that now they have a happy employee and before they didn't. Not criticising, just pointing out a different perspective. Sometimes they'll p
Electronics Forum | Fri Mar 28 01:45:10 EDT 2008 | En-Apple
I have problemabout fault reject rate at AOI very high, due to inspection letter or marking on IC body. It have uncleary. When I check at raw mat'l of IC it no problem but after pass reflow process it show marking not clear ( Laser marking type). Ple
