Electronics Forum | Wed Jul 09 16:09:47 EDT 2003 | russ
I would always recommend that an oven be used. I am not familiar with the ERSA rework system so I cannot comment. The key is to heat evenly with the correct ramp rate. If your rework station does this well then use it. if not I would put through t
Electronics Forum | Tue Jul 15 10:44:49 EDT 2003 | MA/NY DDave
Hi, Although I grit my teeth it does sound like a normal process engineer or engineering situation. Here you are with knowledge and ways to get knowledge of best practices and No One listens. ----- Now I have a cleanliness testing joke (real sto
Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef
When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied
Electronics Forum | Mon Sep 29 18:13:20 EDT 2003 | lysik
Good points Ken But the reality of the matter is that we are selling off some fuji equipment that even though it is 1994/1995 still has a sale value of 45-65K Each. I am replacing it with faster systems with 0201 specs. With the margins so razor thin
Electronics Forum | Tue Oct 21 10:24:54 EDT 2003 | russ
Whoever established the PPM rates should tell you what it is covering (solder joints/assemblies) PPM is nothing more than a ratio. Determining quality levels is really up to you/company and how you want to measure your quality. This can be anything
Electronics Forum | Mon Nov 17 18:40:10 EST 2003 | Ray Wilson
Advanced electronic assembly convection reflow ovens include a variety of options for cooling product after reflow. The Electrovert Omniflo series ovens include options for internal or external cooling systems. What are the pros and cons of utilizin
Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ
Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme
Electronics Forum | Tue Mar 09 09:31:49 EST 2004 | Robert
Yes, in fact I do have 3 T/C connectors but I've never known how to use them nor what to connect to them. I generally address problems by merely changing the recipe up or down depending on what I see on the board(s). Someone mentioned to use a MOLE b
Electronics Forum | Tue Mar 09 22:26:17 EST 2004 | davef
You should to be soldering to the nickel. The intermetallic is Ni3Sn4. "At relatively low temperatures, the tin-nickel layers form about as rapidly as the tin-copper layers do, but at higher temperatures their growth rate is distinctly lower. At 10
Electronics Forum | Fri Apr 30 10:56:27 EDT 2004 | Bryan She
We tested J6 open on .5mm pitch CSP(In fact,only resistance much lower than normal).J6 is one of the corner ball of the CSP.Defect rate is about 3%. Stencil:4 mil thickness,10 mil square aperture, solder mask openning:10 mil diameter circle. Board fi
