Electronics Forum | Fri Nov 18 12:00:06 EST 2005 | rlackey
Hi Lawrence, I would agree with that in the main, however in some cases some machines can be almost "timeless". We don't go below 0402 (1005), missplacements are negligable, and a actual placement rate typically hitting 28-30K an hour makes "upgrad
Electronics Forum | Mon Dec 05 09:38:35 EST 2005 | rlackey
Surely not? I thought it was all free & we were heathens (at least I'm guessing that's what the cable guy insult was meant to mean)for not welcoming it with open arms. O well, back to my biggest technical problem of the next two weeks - what SPF r
Electronics Forum | Wed Dec 14 21:49:18 EST 2005 | grantp
Hi, Yes, I would be interested to know what the nature of the high failure rate is with using lead free BGA parts with a lead process. I had been to a seminar where they said it was ok, but not ok to use a lead BGA in a lead free process. Regards,
Electronics Forum | Wed Jan 18 09:55:09 EST 2006 | chunks
Samir brings up a good point with convection ovens. The flow rate of the fans can move parts, which can cause tombstoning to very light/small components. Also, check you conveyor and or chain. If it is not running smoothly, even a slight shake o
Electronics Forum | Wed Jan 18 16:16:37 EST 2006 | Darnell
Samir brings up uh pimp-tight point wiff convection ovens. The flow rate o' da fans can move parts, which can cause tombstoning ta very light/small components. Also, check ya conveyor an' or chain. If it iz not running smoothly, even uh slight shak
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Wed Mar 08 00:52:47 EST 2006 | ____
Your thinking of the FCP6 vs. CP642. The table on the CP642 is different from the FCP6/FCP6E. The speed for the machines is still rated at 40k cph (0.09). The differences from the FCP6 and FCP6E is the Safety Circuits and a few other electrical dif
Electronics Forum | Mon Mar 13 22:29:50 EST 2006 | davef
Warp depends on: * How close the board gets to its Tg during the reflow cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T
Electronics Forum | Wed Apr 26 09:20:43 EDT 2006 | PWH
I've seen failures like this with multilayer parts that seem to be affected by high activity flux during SMT (water soluable in this process). High, high failure rate in our case. I'm not sure what was going on with our parts but we thought maybe t
Electronics Forum | Wed May 17 14:03:26 EDT 2006 | smt_guru
I have performed research on the latest P&P equipment, and Mydata Company is among the best in terms of placement accuracy to within +/- 5 microns to be exact, and at 20,000 CPH rate outperforming players such as Fuji, Universal, and Panasonic. I wil