Electronics Forum | Wed Aug 25 15:24:07 EDT 2010 | mikesewell
Whatever you would normally use to print that size part on the pcb should work. Same aspect ratio rules apply for release.
Electronics Forum | Sat Mar 21 12:19:51 EST 1998 | David Pick
I have read somewhere of a ratio of component weight vs. surace contact area rule for double reflow soldering. This ratio is the maximum weight vs. surface tension to hold a component on during the second reflow. With this number, a person could weig
Electronics Forum | Wed Jun 20 07:09:59 EDT 2007 | aj
Hi All, Just a quick question in relation to BGA Stencil Aperture Design - We currently use 1:1 ratio - are there any rules or benefits from over printing the PCB Pad ? Replies appreciated. aj...
Electronics Forum | Mon Feb 25 09:34:37 EST 2013 | davef
Oded: The coatings that I mention serve different purposes. * Antiadhesions seem to be designed to improve paste release from the stencil * Flux repellents seem to be aimed at reducing the under wipe frequency of stencils. At IPC APEX 2013, DEK and
Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory
David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef
Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio
Electronics Forum | Wed Feb 18 14:45:33 EST 2004 | Mauro Pinheiro
I'm looking for a shareware software that I could use for specifying stencils (we are stencil users not manufacturers). I would like to enter some preliminary spec in a software form, such as: the smallest pad geometry on pcb (possibly selected from
Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy
| | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but
Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy
| | | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu
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