Electronics Forum: re-balling (Page 1 of 13)

BGA re-balling yields

Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111

We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After

High Volume BGA re-balling

Electronics Forum | Fri May 14 10:30:33 EDT 2004 | steve

What state are you located in? Will supply local contact for you based on your location.

Stencil for BGA re-balling

Electronics Forum | Fri Nov 07 01:01:55 EST 2008 | mskler

What should be stencil size to reball the BGA of 0.6MM ball dia.

BGA re-balling yields

Electronics Forum | Wed Apr 22 08:08:10 EDT 2009 | c111

Thanks! We would outsource as we do not have the man power for this effort

High Volume BGA re-balling

Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen

Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:

BGA re-balling after

Electronics Forum | Tue Jun 25 16:27:11 EDT 2002 | dason_c

Mark, you can check one of the instruction of the BGA reball process as below. http://www.winslowautomation.com/BGA-Reball-Instruct.pdf

High Volume BGA re-balling

Electronics Forum | Thu May 13 20:31:06 EDT 2004 | GS

Try contacting Process Sciences in Austin tx at 512-259-7070 They can do that process for you without you having to lay out a ton of $ for equipment

High Volume BGA re-balling

Electronics Forum | Fri May 14 14:08:04 EDT 2004 | bwet

Perhaps you can try to use the new StencilQuik(TM) technque as it more easily facilitates solder balls dropping onto the pads. Info at http://www.solder.net/stencilquik.asp

BGA re-balling yields

Electronics Forum | Wed Apr 22 07:54:18 EDT 2009 | clampron

Cood Morning, We have a similar situation. We have had a large volume (5K) of RoHS BGA's reballed with 63/37. We have had only a few failures most of which do not appear to be related to that particular BGA. Potential BGA failures are running under

BGA re-balling yields

Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet

There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t

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