Electronics Forum: re-tin (Page 1 of 5)

Solder Re-Tinning

Electronics Forum | Fri Apr 10 12:44:58 EDT 2015 | bandjwet

Does anyone have a clue as to why lead times are running 4-6 weeks on re-tinning of components? Is there a new spec (besides the JSTD-001F) that is causing for this rush towards re-tinning of components?

Re-Tin Leads

Electronics Forum | Thu Mar 25 10:25:46 EST 2004 | sjpence

For lead tinning services you might want to try: www.sixsigmaservices.com www.corfin.net Both of these companies will re-tin SMT.

Cleaning Leads on Parts

Electronics Forum | Wed Nov 17 12:32:37 EST 2010 | stevezeva

Why not just re-tin the parts?

Black pad on BGA after removal

Electronics Forum | Thu May 05 16:02:43 EDT 2005 | russ

I don't believe that you are seeing black pad. I think you are seeing an oxidized pad from your statement that these pads take solder. I would guess that these will be fine. But I would re-tin all pads prior to attaching the BGA to make sure.

Contaminated ICs

Electronics Forum | Fri Apr 15 18:41:35 EDT 2011 | swarnergictg

We had a similar problem with contaminated leads that was rectified by having a company strip the existing finish and re-tin the leads. After the procedure the leads accepted solder with no issues.

Selective Solder Nozzle Life

Electronics Forum | Thu Mar 02 20:39:42 EST 2023 | markhoch

If you're using a good quality nozzle, you can clean the oxidation off with a wire brush and an emery cloth. Just make sure you re-tin it very well before you use it.

Strange reaction with Selective Solder alloy

Electronics Forum | Tue Apr 05 12:31:05 EDT 2022 | proceng1

A while back, we had a yellow coating showing up on some solder joints at Selective Solder (LEAD alloy). I contacted the company for our machine and he looked into it. One change we had made not too long before is we switched from Superior 75 to Sup

Re: Tin-oxide deposits

Electronics Forum | Tue Oct 17 14:40:04 EDT 2000 | Glenn Robertson

Jason - I have only one thing to add to Dave's excellent (as usual) information. Some time back we had a similar problem and we removed the dross bits with a soldering iron and solder wick. Yes, it's tedious and you have to look closely to be

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:32:25 EST 1998 | Earl Moon

| We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon

| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest

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