Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Wed Jul 25 10:46:36 EDT 2001 | Steve
Most of the problems that you will find with NC is visual. I have not found or heard of any real evidence that NC causes component or board failures. The residue has extremely high resistance, which actually gets higher as time goes on. It's a paradi
Electronics Forum | Wed Sep 08 16:00:09 EDT 1999 | Mark D.
My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for my
Electronics Forum | Mon Apr 26 17:20:10 EDT 1999 | Chrys Shea
Hey MoonMan, Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop! "Foiled" again! (te
Electronics Forum | Tue Aug 13 01:53:19 EDT 2002 | kenbliss
Hey Tony Although clearly everyone so far on this forum agrees that there is no real number in real life and virtual life is well....useless. The reality is that what you are really after is maximizing uptime, meaning, look closely at every event t
Electronics Forum | Mon Dec 01 15:16:58 EST 2003 | davef
So, you need to know how these reductions in solder volume will perform in real life. In-use of the product in the life environment is the surest test. Many companies can�t wait / don�t want to pay for that information. * Some use accelerated life
Electronics Forum | Thu Aug 26 13:51:57 EDT 2004 | Dreamsniper
I've done a few capacity and capability studies and bought new SMT equipment (Pick and Place) based on the above required capacity. I did not rely on equipment manufacturer's tact time. I used only 60% of their tact time as achievable in real manufac
Electronics Forum | Mon Jan 10 18:16:32 EST 2005 | ricardof
Greetings from Mexico I can see several good opinions about the "real" need to chnage to Lead-Free processes, but at the end and trying to be real, is there any good path we could follow to stop this process? I can see a lot of work, investment in eq
Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis
Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
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