Electronics Forum: recognition and ball (Page 1 of 26)

Fiducial recognition using laser

Electronics Forum | Sat Apr 03 19:58:53 EST 2004 | Ken

I have used tooling holes and fiucial registration since the late '80's. In fact if your maximum "vision" tolerance is +/- 0.05mm, your in the same ball-park as locating pins. It is true that fiducial registration is more accurate. However, I woul

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 11:35:17 EST 2004 | Kris

what is the composition of the paste and ball ? Interesting to know why the customer is asking you to look for it Thx

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:19:07 EST 2004 | Evtimov

Hi Bryan The answer is in the paste compozition. Balls of the BGA are usually made by eutetic solder paste.

BGA ball and PCB pad

Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe

OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp

I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf

BGA ball and PCB pad

Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W

There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

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