Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Fri Jun 16 17:30:04 EDT 2000 | Eutectic state
Go with Universal. We had Fuji equipment for years. That is all but phased out now and we only are buying Universal. You cannot beat their service. The chip shooters are great. The only cons that I have dealt with is the learning curve on the n
Electronics Forum | Thu May 18 08:32:02 EDT 2000 | Nancy V
Janet, I like Dave's advice. I would send you first to www.smtmag.com They have articles there that give the basics of SMT. Look for the button that says "Step-By-Step SMT." It will give you a touch of what your in for. Then find a good book. I
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Thu Apr 13 18:28:01 EDT 2000 | Michael Parker
Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
Electronics Forum | Thu Mar 23 20:31:45 EST 2000 | davef
Hey Cartman: Recently, I was over at a plant that does ICT on RMA fluxed boards and asked them about flux residue on test probes. The test machine operators: * Think flux residues are a pain in the gluteus maximus. * Change probes (from a collectio
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Tue Feb 22 07:59:54 EST 2000 | Hany A. Salam
Hello friends: In a few weeks we will have to assemble PC motherboards. We decided to use to purchase an ICT for testing the semi assembled boards (I mean with only SMD components on). Would anyone kindly like to recommend a SPECIFIC brand or model