Electronics Forum | Thu Jul 22 07:52:37 EDT 2004 | Chris L.
Hi Grant, The purpose for allowing the solder paste to reach room temp before production is to reduce the amount of water absobtion from the air. (e.g. a cold glass of water "sweats" on a humid day)The purpose for mixing is to make the viscosity more
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Fri Jul 30 04:09:02 EDT 2004 | vinitverma
I would highly recommend Assembleon OpalXII/TopazXII for your low volume high mix applications. You could perform changeovers very quickly. Of course it depends on how many feeders are required per product. If you buy for example, 2 OpalXII machines
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Thu Sep 02 02:30:08 EDT 2004 | Mike Konrad
Silverado, To answer your specific question, there are several manufacturers of batch-format cleaning systems. Aqueous Technologies www.aqueoustech.com Austin American www.aat-corp.com EMC www.emcgti.com UnitDesign www.unitdesign.com Each man
Electronics Forum | Thu Sep 09 03:57:45 EDT 2004 | svi
Hello, We used FujiCAM to prepare FCM programs but now we're thinking to change it to an other software. We have some FCM and some (more) FUJI machines also. We used FujiCAM to controll and proram the lines but we changed it to Fuji FlexA. Microsof
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Tue Oct 05 10:38:43 EDT 2004 | palmerg
Major Japanese OEMs investigated numerous lead-free alternatives, including alloys containing bismuth and/or zinc, such as Sn/Ag/Bi/Cu, Sn/8Zn/3Bi and Sn/58Bi. However, over time, the Japanese industry has moved toward Sn/Ag/Cu alloys. The Japan Elec
Electronics Forum | Wed Oct 06 09:23:51 EDT 2004 | mikecollier
The sampling rate on the KIC software can be changed by the user. The default setting is a sample rate of 60 seconds, so that, every 60 seconds the "old" measurement is subtracted from the "new" measurement to calculate the slope (i.e., start temp i
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
