Electronics Forum | Wed Mar 27 07:41:54 EST 2002 | paul_stamper
As Mitchell stated before, the cleaning of the stencil is rather important. When considering stenciling of adhesive you must review your stencil cleaning process. The recomended process is a ultrasonic cleaner with a heater option. These systems are
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Thu Apr 11 18:26:30 EDT 2002 | TomN
I know the information is out there somewhere, but I need to find information on cost models that apply to reworking motherboards. I had this task dropped in my lap and I�m trying to turn this around quickly. Some background: Products that are diag
Electronics Forum | Mon Apr 15 15:34:07 EDT 2002 | Bob
Hi, I have loads of experience with QP132's. You can change over product quite easily depending on a few things: - � The board sizes should be the same otherwise pallet adjustment can take an hour or so. � If you can fit all the feeders on one set-u
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Mon Apr 29 07:52:43 EDT 2002 | stefwitt
Shall we designers ignore what component vendors recommend how to peel off the cover tape? See Performance Note: http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfilesname/F3102GTaCerPkg.pdf/$file/F3102GTaCerPkg.pdf P.S. Also, note the decen
Electronics Forum | Mon Jun 10 01:08:21 EDT 2002 | Ken Bliss
In response to the original question, �Does anyone know what the industry standards are for machine utilization on a SMT line or across a shop floor?� Ceeris International published a report showing an industry average of 52% utilization of staffed
Electronics Forum | Thu Jun 06 02:15:05 EDT 2002 | Sam
Hi. I'm checkin up needs for AOI or AXI in our SMT lines, and advantages and weak points between AOI and AXI (=automatical x-ray inspection). Our case is high mix low volume production 24h in 5 days of a week, so there are no online time to spend pr
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
