Electronics Forum | Tue Oct 17 21:14:14 EDT 2000 | hankey_cn
Who can tell me the IPC** about the thermocouple for reflow and rework? I'm waiting....
Electronics Forum | Tue Apr 19 13:14:47 EDT 2011 | isd_jwendell
Have you looked at Essemtec for a PnP machine?
Electronics Forum | Wed Apr 20 02:37:02 EDT 2011 | jebs
Thank you for good advise:)
Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz
Thank you Pavel. Aleksander
Electronics Forum | Tue Jul 30 05:28:47 EDT 2019 | ameenullakhan
Your inputs are always valuable and help a lot. Thanks for the inputs.
Electronics Forum | Tue Jul 30 09:50:51 EDT 2019 | ameenullakhan
Attached is the image of lead lift in ccga
Electronics Forum | Wed Jan 30 03:20:00 EST 2019 | bane016
We measure each first board before the oven after every chageover...Assembling one offset and measure component, after we clear plate...We have reason why do that...But we're wasting a lot of time.So I wanted to see how you do it. Thank you for answe
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Electronics Forum | Fri Sep 06 14:07:20 EDT 2002 | ppwlee
Thanks for all replying to my printing SPC posting. I like to expand the SPC discussion on reflow and wave soldering. I am aware of the common methods of applying periodic measurements using test vehicles though the machines to collect critical pr
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear