Electronics Forum | Wed Jul 05 16:26:51 EDT 2006 | flipit
I had one SMT process engineer using rubber bands to hold a connector on second side reflow. Even the operators told him he was nuts. The zero stick through on leaded devices has come up several times for me. We clip leads first and pin in paste t
Electronics Forum | Wed Apr 13 09:43:00 EDT 2011 | dyoungquist
A bit more information will help people give a more educated response. What size res/caps? Any fine pitch ICs? BGAs? Lead or lead free? What quantity of components and/or boards are you loading? Will it be high mix, low volume or lower mix, hig
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Mon Jan 13 14:44:19 EST 2020 | dwl
I wouldn't think the vibration from weights dropping would be significant enough to effect the SMT machines. If you are concerned, look into placing vibration dampening pads under the machine feet. you don't need anything fancy, just neoprene pads wo
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker
Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te
Electronics Forum | Wed Jul 22 13:57:03 EDT 1998 | bill
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai If you are doing any reballing
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Wed Aug 10 11:57:16 EDT 2005 | pr
Is the peelable mask (put on by the boardhouse) flat on the surface of the pcb? If so can you tell me the material name, so maybe I can find a picture? We have to print adhesive on the board, so the mask has to be flat. That is why Kapton from the b
Electronics Forum | Thu Jul 12 16:14:20 EDT 2007 | realchunks
Hi Scott, Hard to tell what kind of problem you really have. I guess you need to describe your process first. What kind of process are you using. Wave solder, reflow solder, etc.. What kind of flux are you using to solder with? Vaccum? What ar
