Electronics Forum | Thu Aug 29 14:15:23 EDT 2019 | reckless
Is heller on that list? Am I the only one who wants smallest coneyorized oven, with lowest zones, using least amount of power, very reliable and repeatable. I currently have essemtecs and an older vitronic 4 zone oven. There is a 2015 rehm oven
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Wed Jun 03 11:17:17 EDT 1998 | Brian Stumm
If your board is single sided you should convey it on a mesh belt conveyor. Unfortunately most assemblies these days are double sided which makes it difficult to convey on the mesh belt. Plus with the increasing population on SM boards the weight is
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Aug 05 10:40:38 EDT 1999 | John Thorup
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually publishe
Electronics Forum | Thu Jun 11 22:03:56 EDT 1998 | Dew Lolly
We own a BTU Convection Oven. Nitrogen helps make shiny joints since it reduces oxidation during reflow. It has helped us solder marginal solderably boards but otherwise if "pretty" and "shiny" is a requirement I would consider it. It doesn't turn
Electronics Forum | Mon Jun 13 09:25:58 EDT 2011 | milroy
Hi I have seen some of our multilayer PCBs are having delamination issues even after baking them in the ovens. Does anybody faced this issue before? The problem occured after reflow process and wave solder process as well. The temp profiles are well
Electronics Forum | Tue Nov 29 12:23:58 EST 2005 | JeffP
>Anyone can do good airflow with a little brains, and so >>delta t is important, but not the main weakness I see on >>batch convection. Actually it is a main weakness with batch and small conveyer ovens on the market. There must be a lot of people
Electronics Forum | Thu Sep 28 11:56:14 EDT 2000 | Steve Thomas
Well the majority of it has been sitting in pails for months, since our supplier quit handling it for us. It's pretty solvent free, at least on top. Do you really do that? It just sounds like another process control headache. Doesn't the oxidation
Electronics Forum | Mon Feb 21 13:35:04 EST 2005 | pmdeuel
we have a HSP 4796, and have had placement issues with 0402's. If you can rule out global correction, rev'ed boards and a loose nest or a lack of support under the board. Look at placement before reflow. If alignment problems are present before oven
