Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip
What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo
Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders
I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f
Electronics Forum | Mon Jul 28 11:31:42 EDT 2008 | blnorman
Ideal situation is get a technical rep from the solder paste supplier. They know their paste better, and should be able to work out a profile based on their paste and your oven. Again, a technical rep, not the sales guy.
Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders
my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem
Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics
If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what
Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1
Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Mon Dec 19 07:29:30 EST 2005 | jax
Tg is just a way to say when the board goes limp... or a quick way to rank laminates... who cares. For lead free you want to look at Td, Decomposition Temperatures. ( Temp at which the material weight changes by 5% )
Electronics Forum | Mon Dec 19 07:49:33 EST 2005 | davef
=330*C is good advice. Search the fine SMTnet Archives for earlier discussions on Td, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32430
Electronics Forum | Mon Dec 19 12:21:09 EST 2005 | Amol Kane
from what i know, Tg is important from thermal stresses point of view. board warpage increases greately when Tg is exceed
