Electronics Forum: reflow and ovens (Page 91 of 361)

SMT Adhesive and Other

Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator

We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s

Pick and Place Nozzles

Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener

I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

Yamaha pick and place

Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob

Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic

Mydata Pick and place

Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt

I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Cp and Cpk values

Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny

Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 16:50:56 EST 2003 | msivigny

Hello Rohan, this is starting to date nearly 6 years ago but I will remember everything I can, we used a custom interface to input data and everything was stored in a very large database on a specific server only for quality data, I think we used Ora

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny

Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im

Pick and Place Rivet

Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost

that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that


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