Electronics Forum | Sat May 01 04:49:21 EDT 1999 | Jeff Sanchez
| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Thu Jan 31 07:49:38 EST 2008 | cyber_wolf
"What do I Really Need" is a subjective question.It all depends on who you ask. I have been in small mom and pop shops that were running BGA's and they were doing some scary stuff.(I wont go into details) In order to put a correct process together y
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic
First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Fri Feb 18 10:19:55 EST 2005 | aj
Hi, As stated by everyone ,you really should have a Profiler and be checking the oven at least once a week. As a quick fix to Identify if you are reaching reflow temp at all, I would recommend that you buy some Thermal Indicators (temp. stickers)th
Electronics Forum | Fri Feb 01 17:53:19 EST 2013 | hegemon
In agreement with Evtimov. Max 5 reflow cycles. Something like this scenario: Build bottomeside 1 Build topside 2 Reflow topside for suspect opens beneath BGA 3 Remove BGA during rework 4 Replace BGA during rework 5 Any convective rework after that,
Electronics Forum | Wed Oct 11 06:52:32 EDT 2017 | smtpatrick
It obviously isn't recommended but I've had aluminium blocks milled out to fit over & weigh down connectors in a previous company when using vapour phase reflow. I guess the same will work in a convection oven as well. You will have to adjust your pr
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
