Electronics Forum: reflow and profil (Page 26 of 305)

Good Profiler for reflow ovens

Electronics Forum | Tue Aug 24 14:33:53 EDT 2004 | Rush Fan

We took delivery on a new DataPaq system about a year ago. This included the ROS software. Best thing we ever did for our reflow proces. The price is right, too.

Good Profiler for reflow ovens

Electronics Forum | Wed Aug 18 08:32:20 EDT 2004 | Santech

If anyone is interested, I have a brand new Super M.O.L.E. Thinline that I am looking to sell. It includes the case and all the software and hardware originally with. It has been used 1 time. Brian 336-337-0333

What caused this reflow issue?

Electronics Forum | Wed Apr 16 09:02:09 EDT 2008 | tonyamenson

One issue stated incorrectly was that the work order that had no problems, with the same layout and same parts, is a one up at SMT. The problomatic units are two ups. I know the first instinct is to say the profile, but we have run this assembly man

CSP and BGA soldering difference.

Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip

"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on

Good Profiler for reflow ovens

Electronics Forum | Mon Aug 16 11:20:09 EDT 2004 | soease

Hi, to profile any type of temperature process, you should try ECD products. I'm used to work with their tool called Super M.O.L.E. Gold, wich is a data logger for six thermocouples that you can run through a reflow oven, for example, and then you c

Good Profiler for reflow ovens

Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant

Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th

Ag/Pd termination, reflow soldering issues

Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev

Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A

Good Profiler for reflow ovens

Electronics Forum | Fri Aug 20 11:34:11 EDT 2004 | soease

Hi Grant, sly again. I was searching for some infos about Auto-SIR, and I found something that may interrest you; Concoat, wich is the company who sells Auto-SIR systems, also has profiling tools and they seem to have a more powerful software to ana

Frequency to verify the reflow profile

Electronics Forum | Fri Jun 03 13:25:07 EDT 2005 | Bob R.

We have enough history to know that frequent profiles are a waste of time. We check the profile once a month, after any significant maintenance, and after a changeover. Other than that we rely on the alarms on the individual zones.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen


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