Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
Electronics Forum | Mon Jul 31 11:55:30 EDT 2006 | crissy
Mi Hard drive crash on reflow oven Model: 1500SX serial N.: 0699D-23579 480V 60A ,any help please.
Electronics Forum | Thu Feb 15 13:47:16 EST 2007 | russ
They are all compatible with each other. Data is at alpha metals website and FCT assembly Russ
Electronics Forum | Thu Feb 15 14:10:59 EST 2007 | Cmiller
Russ is correct. We have been using SAC 305 for SMT and SN100C for wave and selective and repair for about a year. May switch to SN100C in SMT at some point if we can get some paste that wets better.
Electronics Forum | Thu Jun 19 20:52:19 EDT 2008 | davef
Please give us more information about the source of the solder that you mention. Is it: * HASL applied by your supplier * Solder on pads after wave soldering * Solder paste after printing * Solder on pads after reflow soldering ... or what?
Electronics Forum | Tue Sep 30 14:24:37 EDT 2008 | eedlund
A water soluble solder paste (AIM WS483), reflow and wash. We are considering using AIM NC254 No-clean solder paste to eliminate the wash step.
Electronics Forum | Tue Aug 11 18:15:11 EDT 2009 | ysutariya
Have you looked into Sipad? They will pre-paste your BGA and other component areas with solderpaste that has an adhesive on it. You can then hand place your components and run through a reflow. Here's their site: http://www.sipad.com/
