Electronics Forum | Sat Jun 16 07:48:09 EDT 2007 | grantp
Hi, We are using emerson gold, and I have not seen any evidence of black pad, as the pads are clean and gold colored when the part comes off. That is what worried me, as I would have thought that if the solder melted correctly, it would have stuck t
Electronics Forum | Mon Jun 18 10:20:14 EDT 2007 | ck_the_flip
Grant, i have heard of a few cases where the PCB is "reworked" by the PCB house, where the immersion silver that did not wet to the base copper was reworked by just putting immersion silver on top of the non-wetted immersion silver. I know your PCB
Electronics Forum | Tue Jul 31 14:28:20 EDT 2007 | karkanov
Hello, On customer want to make a aluminium board. It will have SMD Led on it. Like I never "played" with this before can someone tell me what I know to know on that new thing. What kind of reflow profile we need. What just I be aware of, is
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | russ
Could be any one of the 3 you mentioned, need some details here, do you really think we can answer this question as it is? Now for your issue, what is the make up of the lead itself on the part? what is the reflow profile at this part? what is
Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
Electronics Forum | Thu Sep 04 07:41:35 EDT 2008 | scottp
I happen to agree with Vlad and I'm not in the same business as him. Randomly turning knobs isn't the way to solve a problem. Do a proper analysis and let the parts tell you what's happening. Seems like a lot of problems people post on this forum
Electronics Forum | Wed Aug 27 09:30:22 EDT 2008 | vladig
Hi Eyal, Sure you can do that. You might be able to use your "typical" reflow profile for eutectic, or tweak it slightly. it's a good idea to do a trial run and then get a couple of components cross-sectioned and checked for the microstructure of th
Electronics Forum | Thu May 14 06:55:59 EDT 2009 | davef
While you're waiting for others to reply: * Search the fine SMTnet Archives to find threads like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=28544 * Checkout Daan Terstegge's excellent jump site http://www.smtinfo.net/Db/_Ball%20Grid%2
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Fri Sep 04 15:33:09 EDT 2009 | martinphill
Is it possible to Process Top & Bottom side PCBA simultaneously in One SMT Line. (An atrticle by Jagadeesh Rajagopalan, SMT Process consultant). Pls check this and suggest me whether it is possible? & What should be the Lead free Reflow Profile? ht
