Electronics Forum | Thu Jun 13 19:58:51 EDT 2002 | john_wsme
Dear All, We have a SRT BGA rework machine and we created several profiles following solder reflow reqirement, but when we installed BGAs, we saw a lot of solder bridging in the conner. Please give us some ideas to eleminate this problem. Thanks in
Electronics Forum | Thu Feb 14 07:33:24 EST 2008 | cyber_wolf
Does anyone have any experience with this component ? We seem to have some warping issues through reflow. We have tried everything profile wise....pre bake parts etc.
Electronics Forum | Fri Jan 17 02:29:59 EST 2020 | soupy
Thanks Dave, We have avoided rotating the board as it is so long but we will test. Maybe we will to try screen it in one direction and then rotate it before the oven. We have the maximum solder we can get there at the moment. The reflow engineer
Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw
Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Thu Apr 26 08:34:32 EDT 2007 | ck_the_flip
Pavel is right...Your Quality Group, customers, and Management will really appreciate Cpk's. We do Cpk's annually, or whenever a major mechanical change (motor, blower, etc) is made. Pavel is correct in saying that Cpk's on most modern convection o
Electronics Forum | Sun Jan 16 01:50:39 EST 2011 | leo83
Dear All, I am looking for a guide /book on PCB assembly using SMT(Middle range, not high speed) which i could use for selection of Machines. If their is any research report , i am ready to pay for it. Highly appreciate any inputs. Eg: What shoul
