Electronics Forum | Thu Jul 12 10:45:42 EDT 2001 | Hussman
Since your customer is complaining, you'd better be pro-active. Doesn't mean they're right, but without customers, life sux alittle. Anyway, ask them for a profile of the 5 reflow processes. If they don't have that and you have a profiler, ask if
Electronics Forum | Mon Jan 28 13:20:48 EST 2008 | tonyamenson
New to thermal profiling (leaded and lead free), and my boss wants me to search for a better profiler. Currently our model has three ports for thermal couple inputs. We are established in our noraml process but we are relatively new to incorperate m
Electronics Forum | Fri May 24 19:18:03 EDT 2013 | hegemon
The formula is a great help, where was it 20 years ago? LOL After running a few thousand different products over the years, you start to get a feel for what is going to be trouble with regards to falling off the bottomside during the secondary refl
Electronics Forum | Sat Jan 05 02:03:19 EST 2002 | hany_khoga
Dear all: For PBGA replacement by a hot air BGA rework station, do I have to follow the same temperature profile as the first original one in the reflow oven? Note that in the rework process I use only Flux paste (no solder paste is used). Hany
Electronics Forum | Thu Jun 01 10:08:59 EDT 2006 | ratsalad
I sewed a sock out of a Nomex/Kevlar blend fabric because we had the same problem with our profiler. It works great. After one run through the reflow oven, the internal temp rises by about 5 degrees C. It used to go up by about 20-25 C. I can pic
Electronics Forum | Thu Oct 22 21:52:40 EDT 2009 | ericg2000
I recently started a company that uses BTU Pryamax reflow oven (7 heat zones, 2 cooldown). Any advice on creating profiles for both leaded and lead free products? also what can you tell me about oven profiling with this model? i'm told it has buil
Electronics Forum | Thu Apr 16 10:11:51 EDT 2015 | hugh_manatee
Your solder paste manufacturer’s profile is just a “guideline.” You can customize your profile to meet your product’s need. For better grain-structure (shiney-ness) try a ramp soak spike profile keeping your preheat temps very low before your reflo
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Wed Aug 18 11:52:35 EDT 1999 | Brian
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Wed Jul 07 18:22:25 EDT 1999 | ETS - Brian Stumm
My company, ETS, is a manufacturer of solder reflow and curing ovens. I would be happy to share some of our q/c test methods with you for verifying the uniformity and repeatability of the new ovens we manufacture. I think these tests will tell you al
