Electronics Forum | Tue Apr 25 22:16:31 EDT 2006 | KEN
I agree with Russ. The problem is your thermal isolation is so small 1/16 inch. Also, most ovens measure temperaure in the plenum. You don't solder in the plenum. Therefore, you have a intermidiate "zone" temp. mixing between the top and bottom
Electronics Forum | Thu Apr 26 09:05:16 EDT 2007 | realchunks
Hi D0m0 Can you standardize on your temps and just adjust conveyor speeds for various sizes of the boards? Another trick is to parallel t-couple plug off the actual t-couples of the oven and mount the plug in an easy access point of the oven. The
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Fri Mar 26 15:36:50 EDT 2010 | krish_bala
Hello Graham, We are currently using Tacky Gel Flux during our replacement process. We dip the BGA component on the flux prior to placement. Once it is dipped, the alignment and placement is done. As for the profile, I believe I am hitting the corr
Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory
Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc
Electronics Forum | Sun Mar 11 08:28:10 EDT 2007 | dave
Hi All, I would like to get some advice from users who place rfshields pre-reflow and reflow onto board. We ran a batch a few months back and boards which had the shields reflowed failed to function properly ~ I was happy enough that the profile
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee
