Electronics Forum: reflow and profile (Page 226 of 305)

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 21:07:00 EDT 1999 | Deon Nungaray

| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW

| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu

QFP Defect

Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie

Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t

Re: Problems with wave solder

Electronics Forum | Thu Nov 19 10:12:38 EST 1998 | Brian Conner

| For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder a

Flex circuits

Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh

Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Fri Feb 24 10:08:16 EST 2006 | russ

What happens is: we generate a profile that works and it is fine. however, If we run this profile continously say for an ECO upgrade or something where we are not just doing 1 or 2 we find that as we continue on the profile gets hotter and hotter i

BGA Training

Electronics Forum | Thu May 26 15:59:40 EDT 2005 | davef

Let�s not get drawn into making more of the amount of training required in order to be able to develop an effective reflow recipe than is necessary. A low-skilled operator with about one hour's training can setup the solder reflow oven. Consider co

EL Cap _ Missing & Shifted out of the Copper Pad

Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob

Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Thu Dec 21 20:13:02 EST 2000 | Brad Kendall

I used to switch my N2 on and off for different products and I had performed profiles on the products with and without the N2 on and there was not a difference in the profiles. So you should not have to adjust your profiles. I think everyone else c


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