Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1
I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that
Electronics Forum | Wed Jan 14 08:28:15 EST 1998 | Allison
Contact your solder paste manufacturer and get the reflow profile recommended for that particular paste. Then, duplicate that reflow profile on your oven. You will need to use thermocouples. You may have to tweak this profile a little. | We use no
Electronics Forum | Tue Jan 22 20:37:48 EST 2002 | davef
Try: * Searching the fine SMTnet Archives. We have ground profiling, thermocouple attach, etc. to pulps. * Buying [ http://www.ipc.org ] IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Tue Feb 19 09:41:26 EST 2008 | slthomas
ECD sells the MOLE, and they sell both the Oven Rider and the Wave Rider to accompany it. The thing is, you can profile both an oven and a wave machine without either if you're willing to just solder your thermocouples to a board. The nice thing ab
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Fri Mar 26 11:13:04 EST 2004 | Mike Konrad
jdomont, No-cleans are more difficult to clean than RMA�s. Even though no-cleans have a lower solids content than RMA�s, reflow and soldering profiles are normally more severe than those used for RMA. It is interesting to note that our most of our
Electronics Forum | Wed Jan 07 13:17:56 EST 2004 | James
We currently have 2 HVA 102 conceptronic reflow ovens. I ran 2 profiles on the 2 seperate machines. One of the oven ran 7 degrees lower than the other oven. I checked all the fans and they seem to running fine. I get no warning on the monitors.
Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0
hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6
