Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef
I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel
Electronics Forum | Fri Jan 08 08:00:40 EST 2016 | proceng1
We utilize the built in profiling equipment in our reflow ovens. It's somewhat tedious to have the operator stand there and feed the TC wires in as the board progresses through the oven. Otherwise the wires sometimes hang up and the board stops mov
Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef
I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME
Electronics Forum | Wed May 28 08:46:39 EDT 2008 | ck_the_flip
I've talked to several Applications Engineers and Chemists from a couple of different paste manufacturers and they confirm that the profiles on their data sheets are nothing but guidelines. It's up to you, Process Engineer or Process Tech, to develo
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Thu Jan 14 08:34:18 EST 2016 | cyber_wolf
His suggestion is that you come into the 21st century and buy a data logger rather than feeding wires through the entire reflow oven. That is old school and it is very cumbersome as you undoubtedly know. If you are in a position where a logger is no
Electronics Forum | Mon Oct 08 09:48:22 EDT 2007 | slthomas
I used to just follow up profile development with a single pass with a MOLE, one thermocouple in air. I'd keep that profile as a baseline, and have the operators run the MOLE through prior to production and compare the results to the baseline. I foun
Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Tue Jun 28 18:20:49 EDT 2005 | russ
Matt, have you run a profile on this board? Just because it's .062" doesn't mean that any old .062" profile will work. We have .062" thick boards that almost nil for copper and other are utilizing 2 oz. layers internally. They require quite diffe
